Solder Bumping Service
Our company has processing equipment (line) in a clean room (Class 10,000)! We can provide contract processing services such as bumping services and cleaning services!
We would like to introduce the "Solder Bumping Service" offered by Guden Machinery Co., Ltd. We are equipped with a dedicated solder paste printing machine (TD-4422) and a bump flattening device (TD-2011) specifically designed for bumping, all within a dedicated clean room. We provide pre-solder processing services supported by the high technical capabilities of our product development group. Using solder paste allows for low costs, and since it is not plated, we can achieve short delivery times. Additionally, we can accommodate narrow pitches of 120μm. We have over 10 years of experience in solder bumping (SOP) for the following applications: - Graphic memory - Automotive microcontrollers - Analog devices - Data storage memory 【Features】 ■ Solder bumps formed by paste printing ■ Low cost using solder paste ■ Short delivery times as it is not plated ■ Accommodates narrow pitches of 120μm * For more details, please refer to the PDF document or feel free to contact us. Evaluation demos in a clean room (Class 10,000) are also available. Please do not hesitate to reach out.
- Company：谷電機工業
- Price：Other
